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U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips

July 09, 2024

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The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.

Don Clark | NYTimes Technology | Disclosure

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U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.

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